SEMI China President Feng Li: The HBM market size in China will grow by 58% to $54.6 billion by 2026, with an HBM capacity gap of 50%–60%

MarsBitNews · 2026-03-26T06:33:30+00:00

SEMICON China 2026 will be held in Shanghai. Feng Li stated that the global semiconductor industry will reach a trillion-dollar market by the end of 2026. The three major trends are a significant increase in AI computing power, a storage revolution, and technology-driven upgrades, driving demand for wafer fabs, packaging, and materials.

MarsBitNews

2026-03-26 06:33:30

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Mars Finance News: On March 26, SEMICON China 2026, the International Semiconductor Exhibition, officially opened in Shanghai. SEMI China President Feng Li stated in her speech that driven by AI computing power and the global digital economy, the semiconductor industry is entering a historic moment. The trillion-dollar chip era, originally expected to be reached by 2030, is now anticipated to arrive ahead of schedule by the end of 2026. She highlighted three major trends in the semiconductor industry for 2026.

First trend: AI computing power. Global AI infrastructure spending will reach $450 billion in 2026, with inference computing power accounting for over 70% for the first time. This drives strong demand for GPUs, HBM, and high-speed network chips, which ultimately translates into robust demand for wafer fabs, advanced packaging, equipment, and materials.

Second trend: Storage revolution. Storage is a core strategic resource of AI infrastructure. The global storage output will surpass wafer foundry for the first time, becoming the leading growth driver in semiconductors. In 2026, the HBM market size will grow by 58% to $54.6 billion, accounting for nearly 40% of the DRAM market. The increasing demand has led to supply and demand imbalance. Although major manufacturers like Samsung, SK Hynix, and Micron have allocated 70% of new and adjustable capacity to HBM, the HBM capacity gap remains at 50%–60%.

Third trend: Technology-driven industry upgrade. As 2nm and below process nodes approach physical limits, challenges such as quantum tunneling and gate control issues arise, with GAA architecture experiencing diminishing marginal benefits. Building a 2nm wafer fab costs over $25 billion, nearly three times the cost of a 7nm fab. The strategic position of advanced packaging becomes more prominent. The dual drive of “advanced process + advanced packaging” promotes industry upgrading from a system-level perspective. (Cailian Press)

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