Institutions: Wafer foundry and packaging/testing costs are rising simultaneously, and DDIC suppliers are considering price increases.

MetaMuskRat · 2026-03-28T02:06:09+00:00

People's Financial News, March 27 — According to the latest survey by TrendForce, starting from 2025, the costs of semiconductor wafer foundry and backend packaging and testing will gradually increase, and the prices of precious metal raw materials continue to rise, adding to the cost pressure on display driver ICs (Display Driver IC, DDIC) manufacturers. Some industry players have recently begun communicating with panel customers to assess the possibility of raising prices.

MetaMuskRat

2026-03-28 02:06:09

People’s Finance News, March 27 - According to the latest survey by TrendForce, starting in 2025, the costs of semiconductor wafer foundry and backend packaging testing will gradually increase, and the prices of precious metal raw materials will continue to rise, adding pressure to the cost for display driver IC (DDIC) manufacturers. Some companies have recently begun communicating with panel customers to assess the possibility of raising their quotes.

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