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TSMC: Its silicon photonics integration platform COUPE is expected to enter mass production this year
TSMC stated that its silicon photonics integration platform COUPE is expected to enter mass production this year, marking a key milestone in promoting the implementation of co-packaged optics (CPO) and signaling that AI optical communication is officially entering the final stage of industrialization. It is reported that the COUPE platform integrates optical engines and various computing and control ASICs on the same package load board or intermediary device through SoIC technology, bringing components closer together, increasing bandwidth and power efficiency, and reducing electrical coupling losses. (Science and Technology Innovation Board Daily)